FR4 TG150 Printed Circuit Boards 4 Layer PCB 0.8 MM 1 OZ CU

Printed Circuit Boards 4 Layer PCB 0.8 MM 1 OZ CU

Specifications:

1. Board Laminate:

Board layers 4 layer see layer stackup

Board material laminate should be 0.031inch +/-10%

Finished glass epoxy laminate, type nema grade or equivalent

Outer layer to be 0.5OZ Copper clad

Construction should meet class 94v-0

Layer construction alignment max: +-0.05mm

2. Holes:

Copper plate through all holes with a minimum wall thickness of 0.0254mm

Register tolerance : +-0.015mm

All holes must be drilled +-0.051mm with respect to center of drilled pad

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.

FQA:

Q1: What is HDI PCB?

A1: HDI is the abbreviation of high density interconnector. Generally, there are blind and buried holes in HDI PCB. Due to the space limits, some product need to very small size pcb. HDI pcb was generated to save space and increase interconnectors.

FR4 TG150 Printed Circuit Boards

1 OZ CU Printed Circuit Boards

OEM PCB 0.8 MM

FR4 TG150 Printed Circuit Boards 4 Layer PCB 0.8 MM 1 OZ CU Images